pb lead-free parts ligitek electronics co.,ltd. property of ligitek only la112b/yx-pf data sheet led array doc. no : qw0905-la112b/yx-pf rev. : a date : 07 - jan. - 2008
- + 3.3 4.3 1.5max 1.0min 2.54typ 0.5 typ 2.9 3.1 25.0min page 1/5 package dimensions ly2640-1-pf note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. part no. la112b/yx-pf ligitek electronics co.,ltd. property of ligitek only 2.54typ 6.99 0.5 + - 9.6 5.0 2.9 2.65 0.5 typ 3.2 0.3 x 8.2 4.3 y 2.5 0.5
part no. la112b/yx-pf page 2/5 unit ma ma y 20 80 absolute maximum ratings i f i fp parameter peak forward current duty 1/10@10khz forward current symbol absolute maximum ratings at ta=25 mw a 10 60 -40 ~ +85 -40 ~ +100 pd ir t opr operating temperature reverse current @5v power dissipation storage temperature tstg 50 2.68.0 max.min. typ. 12 1.7 35 min. 585 forward voltage @20ma(v) peak wave length pnm spectral halfwidth nm viewing angle 2 1/2 (deg) luminous intensity @10ma(mcd) color emitted yellow la112b/yx-pf gaasp/gap part nomaterial typical electrical & optical characteristics (ta=25 ) lens yellow diffused note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. ligitek electronics co.,ltd. property of ligitek only
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip 3/5 page part no. la112b/yx-pf
part no. la112b/yx-pf time(sec) 2 /sec max 25 preheat 0 0 50 100 120 5 /sec max 150 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) temp( c) 260 260 c3sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) ligitek electronics co.,ltd. property of ligitek only page 4/5 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max
part no. la112b/yx-pf ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=85 2.rh=85% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. page 5/5
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